Method for forming a storage cell capacitor compatible with high dielectric constant materials

ABSTRACT

An integrated circuit structure includes a digit line and an electrode adapted to be part of a storage cell capacitor and includes a barrier layer interposed between a conductive plug and an oxidation resistant layer. An insulative layer protects sidewalls of the barrier layer during deposition and anneal of a dielectric layer. The method includes forming the conductive plug recessed in an insulative layer. The barrier layer is formed in the recess and the top layer. An oxidation resistant conductive layer and a further oxide layer are formed in the recess. The conductive layer is planarized to expose the oxide or oxide/nitride layer. The oxide layers are then etched to expose the top surface and vertical portions of the conductive layer. A dielectric layer is formed to overlie the storage node electrode. A cell plate electrode is fabricated to overlie the dielectric layer.

This is a Continuation of application Ser. No. 09/489,954, filed Jan.24, 2000, which is a Divisional of application Ser. No. 08/572,392,filed Dec. 14, 1995, now U.S. Pat. No. 6,030,847, which is aContinuation-In-Part of application Ser. No. 08/390,336 filed on Feb.17, 1995, now U.S. Pat. No. 5,478,772 which is a continuation of Ser.No. 08/044,331 filed on Apr. 2, 1993, now abandoned.

A continuation of Ser. No. 08/313,677 filed on Sep. 27, 1994, now U.S.Pat. No. 5,506,166 which is a divisional of Ser. No. 08/104,525 filed onAug. 10, 1993, now U.S. Pat. No. 5,381,302 and which may contain similarmaterial. All of the above applications are incorporated herein byreference.

FIELD OF THE INVENTION

This invention pertains to semiconductor technology, and moreparticularly to storage cell capacitors for use in dynamic random accessmemories.

BACKGROUND OF THE INVENTION

As memory devices become more dense it is necessary to decrease the sizeof circuit components. One way to retain the storage capacity of adynamic random access memory (DRAM) device and decrease its size is toincrease the dielectric constant of the dielectric layer of the storagecell capacitor. In order to achieve the charge storage efficiency neededin 256 megabit (Mb) memories and above, materials having a highdielectric constant, typically greater than 50, can be used as thedielectric layer to insulate the storage node electrode and cell plateelectrode of the storage cell capacitor one from the other. A dielectricconstant is a value characteristic of a material and is proportional tothe amount of charge that can be stored in the material when it isinterposed between two electrodes. Ba_(x)Sr_((1-x))TiO₃ [BST], BaTiO₃,SrTiO₃, PbTiO₃, Pb(Zr,Ti)O₃ [PZT], (Pb,La) (Zr,Ti)O₃ [PLZT], (Pb,La)TiO₃ [PLT], KNO₃, and LiNbO₃ are among some of the high dielectricconstant materials that can be used in this application. These materialshave dielectric constant values above 50 and will likely replace thestandard Si₃N₄, SiO₂/Si₃N₄, Si₃N₄/SiO₂, or SiO₂/Si₃N₄/SiO₂ compositefilms used in 256 kilobits (Kb) to 64 megabits (Mb) generations ofDRAMs. Si₃N₄ and SiO₂/Si₃N₄ composite films have dielectric constantvalues of 7 or less. The storage node and cell plate electrodes are alsoreferred to as first and second electrodes.

Unfortunately BST is incompatible with existing processes and can not besimply deposited on a polysilicon electrode as was the case for thelower dielectric constant materials, such as Si₃N₄ and SiO₂/Si₃N₄composite layers. In the storage cell capacitor incorporating BST,described in the IDEM-91 article entitled, A STACKED CAPACITOR WITH(Ba_(x)Sr_(1-x)) TiO₃ FOR 256M DRAM by Koyama et al., the storage nodeelectrode typically comprises a layer of platinum overlying a tantalumlayer which, in turn, overlies a polysilicon plug. Platinum is used asthe upper portion of the first electrode since it will not oxidizeduring a BST deposition or subsequent anneal. An electrode that oxidizeswould have a low dielectric constant film below the BST, therebynegating the advantages provided by the high dielectric constantmaterial. The tantalum layer is introduced to avoid Si and Ptinter-diffusion and to prevent the formation of SiO₂ on top of theplatinum surface. In addition, the platinum protects the top surface ofthe tantalum from strong oxidizing conditions during the BST deposition.FIG. 1 depicts the stacked storage node electrode comprising tantalum 1,platinum 2 (Ta/Pt) overlying the polysilicon plug 3.

However, the sidewalls 4 of the tantalum 1 formed during this processare subject to oxidation during the subsequent deposition of the BSTlayer. Since the tantalum 1 oxidizes the polysilicon plug 3 is alsosusceptible to oxidation. When portions of the polysilicon plug 3 andtantalum 1 are consumed by oxidation the capacitance of the storage cellcapacitor is decreased since the storage node electrode is partiallycovered by a low dielectric constant film. Therefore the memory devicecannot be made as dense. In addition, the storage node contactresistance increases drastically.

SUMMARY OF THE INVENTION

The invention is a storage node capacitor having a storage nodeelectrode comprising a barrier layer interposed between a conductiveplug and an oxidation resistant conductive layer and the method forfabricating the same. A thick insulative layer protects the sidewalls ofthe barrier layer during the deposition and anneal of a dielectric layerhaving a high dielectric constant.

The method comprises forming the conductive plug in a thick layer ofinsulative material such as oxide or oxide/nitride. The conductive plugis recessed from a planarized top surface of the thick insulative layer.The barrier layer is formed in the recess. The process is then continuedwith a formation of an oxidation resistant conductive layer and thepatterning thereof to complete the formation of the storage nodeelectrode.

Next a dielectric layer having a high dielectric constant is formed tooverly the storage node electrode and a cell plate electrode is thenfabricated to overly the dielectric layer.

Since the barrier layer is protected during the formation of thedielectric layer by both the oxidation resistant conductive layer andthe thick insulative layer there is no oxidation of the barrier layer orthe contact plug thereby maximizing capacitance of the storage node andreducing high contact resistance issues.

The invention includes a storage node capacitor having a storage nodeelectrode comprising a barrier layer interposed between a conductiveplug and an oxidation resistant conductive layer and the method forfabricating the same. A thick insulative layer protects the sidewall ofthe barrier layer during the deposition and anneal of a dielectric layerhaving a high dielectric constant.

In one preferred implementation the method comprises forming theconductive plug in a thick layer of insulative material such as oxide oroxide/nitride. The conductive plug is recessed from a planarized topsurface of the thick insulative layer. The barrier layer and theoxidation resistant layer are formed in the recess. A portion of thethick insulative material is removed to expose portions of the oxidationresistant layer. Remaining portions of the thick insulative materialcontinue to encompass the barrier layer.

Next a dielectric layer having a relatively high dielectric constant isformed to overlie the storage node electrode and a cell plate electrodeis then fabricated to overlie the dielectric layer. In this preferredimplementation, since the barrier layer is protected during theformation of the dielectric layer by both the oxidation resistantconductive layer and the thick insulative layer there is little or nooxidation of the barrier layer or the contact plug, thereby maximizingcapacitance of the storage node and reducing high contact resistanceissues.

In one particular preferred embodiment, the barrier layer is tantalum oranother material which experiences no oxidation during the formation ofthe storage cell capacitor. The oxidation resistant conductive layer ispreferably a non-oxidizing conductive material such as platinum. Thedielectric layer is preferably Ba_(x)Sr_((1-x))TiO₃ [BST].

The insulative layer and the oxidation resistant layer protect thebarrier layer from oxidizing during the deposition and anneal of the BSTthereby also eliminating oxidization of the conductive plug. Byminimizing or eliminating oxidization of the barrier layer and theconductive plug capacitance is maximized.

An embodiment of the invention is a product and method for forming samecomprising a storage contact capacitor of a dynamic random access memory(DRAM) device wherein the lower storage node capacitor plate comprisestungsten and TiN portions. An initial TiN region is self-aligned to andin contact with the contact area of the substrate. The initial tungstenportion is embedded in the TiN region. The storage contact capacitor ofthe invention utilizes the vertical portion of the DRAM by fabricatingat least a portion of the storage node capacitor plate vertically in theDRAM. The vertical fabrication increases capacitor area while maximizingdie space.

The capacitor area of an embodiment is increased by forming at least onecavity surrounding at least one upper portion of the tungsten. Thecavity is formed by controllably etching portions of the TiN. Thefabrication of the storage capacitor is complete following thedeposition of a dielectric layer to overlie exposed TiN and tungstenportions and a previously fabricated oxide portion. Cell polysilicon isdeposited to overlie the dielectric layer, the cell polysilicon formingthe cell plate. A conductive material is then deposited to overlie thecell plate and function as a cell plate contact.

In an embodiment only one layer of TiN and one layer of tungsten isdeposited. In another embodiment, at least two more layers, at least oneof TiN and at least one of tungsten are alternately deposited. In theseoond embodiment, etching the TiN layers effects an elevationallystacked fin structure of tungsten. The height of the structure isdependent on the number of alternatively layers and the thickness of thelayers. TiN retained after the etch provides electrical communicationbetween the tungsten layers as well as between the contact area of thesubstrate and the first deposited TiN layer.

A self-aligned opening exposing a contact region of silicon substrate iscreated by masking and etching previously fabricated layers of thesemiconductor device. An initial TiN layer is deposited to overlie theexposed substrate and previously fabricated layers. A tungsten fill isdeposited to overlie the TiN layer. At this juncture, alternating layersof TiN and tungsten may be deposited. An upper portion of the TiN isetched forming a cavity surrounding each upper portion of the tungstenlayer. The tungsten and TiN comprise the storage node capacitor plate. Adielectric layer is deposited to overlie the tungsten and TiN and thepreviously fabricated layers. Cell polysilicon is deposited to overliethe dielectric layer and forms the cell plate.

Embodiments of the invention allow the vertical portion of a DRAM deviceto be utilized as the storage cell thus maximizing die space in thehorizontal direction, and reducing the stack capacitor height prior tocontacts. The TiN etch maximized the cell size by increasing the area ofthe storage node plate. The cell plate contact and the cell plate areself-aligned. A mask step is eliminated over previous methods sincethere is no cell polysilicon mask. The process facilitates the effectiveuse of a buried digit line configuration. In addition there are no bitline stringers, thus yield is increased.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a portion of a partially processedsemiconductor wafer of the related art.

FIGS. 2-11 are cross-sectional views of a portion of a partiallyprocessed semiconductor wafer depicting the steps of the invention forfabricating a storage cell capacitor.

FIG. 2 depicts field-effect transistors overlying a silicon substrateand wordlines overlying field oxide.

FIG. 3 is the wafer portion of FIG. 2 following the deposit of anundoped thick oxide layer and planarization thereof.

FIG. 4 is the wafer portion of FIG. 3 following the masking andsubsequent etching of the deposited oxide layer to form self-alignedopenings.

FIG. 5 is the wafer portion of FIG. 4 following the formation ofpolysilicon plugs in the openings and the removal of the mask shown inFIG. 4.

FIG. 6 is the wafer portion of FIG. 5 following the recessing of thepolysilicon plug in the thick oxide layer.

FIGS. 7 a and 7 b are wafer portions of FIG. 6 following the depositionof a tantalum layer.

FIGS. 8 a and 8 b are wafer portions of FIGS. 7 a and 7 b following theplanarization of the tantalum layer.

FIGS. 9 a and 9 b are wafer portions of FIGS. 8 a and 8 b following thedeposition of a platinum layer.

FIGS. 10 a and 10 b are the wafer portions of FIGS. 9 a and 9 bfollowing the etching of the platinum layer to complete the formation ofthe storage node.

FIGS. 11 a and 11 b are wafer portions of FIGS. 10 a and 10 b followingthe deposition of a BST dielectric layer and a cell plate layer andpatterning of these layers to complete the formation of the storage cellcapacitor.

FIG. 12 is the cross sectional view of FIG. 5 following the formation ofa recess in the oxide layer.

FIG. 13 is the cross sectional view of FIG. 12 following the depositionof a barrier layer.

FIG. 14 is the cross sectional view of FIG. 13 following an etch back ofthe barrier layer.

FIG. 15 is the cross sectional view of FIG. 14 following a deposition ofan oxidation resistant layer.

FIG. 16 is the cross sectional view of FIG. 15 following a further oxidedeposit and the planarization of the oxide and the oxidation resistantlayer.

FIG. 17 is the cross sectional view of FIG. 16 following an etch back ofthe oxide deposits.

FIG. 18 is the cross sectional view of FIG. 17 following formation of adielectric layer and cell plate layer.

FIG. 19 is the cross sectional view of the capacitor made by the processdescribed in steps 2-5 and 12-19.

FIG. 20 is the cross sectional view of FIG. 12 following the formationof a conductive layer.

FIG. 21 is the cross sectional view of FIG. 20 following removal of nonsilicide portions of the refractory metal (or metal nitride) layer.

FIG. 22 is the cross sectional view of FIG. 21 following the formationof a barrier layer.

FIG. 23 is the cross sectional view of FIG. 22 following an etch back ofthe barrier layer.

FIG. 24 is the cross sectional view of FIG. 23 following a deposition ofan oxidation resistant layer.

FIG. 25 is the cross sectional view of FIG. 24 following a further oxidedeposit and the planarization of the oxide and the oxidation resistantlayer.

FIG. 26 is the cross sectional view of FIG. 25 following an etch back ofthe oxide deposits.

FIG. 27 is the cross sectional view of FIG. 26 following formation of adielectric layer and cell plate layer.

FIG. 28 is the cross sectional view of the capacitor made by the processdescribed in steps 2-5, 12, and 20-28.

FIG. 29 is a cross-sectional view of a portion of a partially-processedsemiconductor wafer which depicts field-effect transistors (FETs)overlying a silicon substrate and wordlines overlying field oxide.

FIG. 30 is a cross-sectional view of the wafer portion of FIG. 29following the deposit of an undoped thick oxide layer and planarizationthereof.

FIG. 31 is a cross-sectional view of the wafer portion of FIG. 30following the masking and subsequent etching of the deposited oxidelayer to form a self-aligned opening.

FIG. 32 is a cross-sectional view of the wafer portion of FIG. 31following the masking of deposited layers of polysilicon and WSi.sub.x.

FIG. 33 is a cross-sectional view of the wafer portion of FIG. 32following a reactive ion etch (RIE) of the deposited polysilicon andWSi.sub.x layer to form a buried digit line, the removal of thephotoresist shown in FIG. 32, the deposit of a thick doped oxide layer,and masking thereof to define future contact areas for storage contactcapacitors.

FIG. 34 is a cross-sectional view of the wafer portion of FIG. 33following an RIE etch of the oxide layers to create openings for thelower capacitor plates as well as the contact openings for peripherycontacts and following the removal of the photoresist.

FIG. 35 is portion of the cross-sectional view of the wafer portion ofFIG. 34 following the deposition of a IKA thick TiN layer and a tungstenfill of the opening.

FIG. 36 is a cross-sectional view of the wafer portion of FIG. 35following a planarization of the TiN and tungsten to form a plug.

FIG. 37 is a cross-sectional view of the wafer portion of FIG. 36following a controllable and selective TiN etch.

FIG. 38 is a cross-sectional view of the wafer portion of FIG. 37following blanket depositions of a thin silicide layer and a dielectriclayer and following a deposition of a cell polysilicon. A nitride layeris deposited to overlie the cell polysilicon.

FIG. 39 is a cross-sectional view of the wafer portion of FIG. 38following patterning of the storage capacitor with photoresist.

FIG. 40 is a cross-sectional view of the wafer portion of FIG. 39following an RIE etch of the nitride layer, the cell polysilicon, thedielectric layer and the silicide layer, and following the removal ofthe photoresist. FIG. 40 also depicts the oxidation of the polysiliconand silicide exposed during the etch.

FIG. 41 is a cross-sectional view of the wafer portion of FIG. 40following the deposition of a conductive layer and following thenoncritical patterning of the cell array.

FIG. 42 is a cross-sectional view of the wafer portion of FIG. 41following an RIE metal etch of the conductive layer and following theremoval of the photoresist pattern.

FIG. 43 is a cross-sectional view of a portion of the wafer portion ofFIG. 34 following alternating depositions of TiN and Tungsten.

FIG. 44 is a cross-sectional view of the wafer portion of FIG. 43following the masking and RIE etch of the alternating depositions.

FIG. 45 is a cross-sectional view of the wafer portion of FIG. 44following a selective and controllable etch of the TiN layers andremoval of the photoresist.

FIG. 46 is a cross-sectional view of the wafer portion of FIG. 45following blanket depositions of a thin silicide layer and a dielectricand following a deposition of cell polysilicon. A nitride layer isdeposited to overlie the cell polysilicon.

FIG. 47 is a cross-sectional view of the wafer portion of FIG. 46following patterning of the storage capacitor with photoresist.

FIG. 48 is a cross-sectional view of the wafer portion of FIG. 47following an RIE etch of the nitride layer, the cell polysilicon, thedielectric layer and the silicide layer, and following the removal ofthe photoresist. FIG. 40 also depicts the oxidation of the polysiliconand silicide exposed during the etch.

FIG. 49 is a cross-sectional view of the wafer portion of FIG. 48following the deposition of a conductive layer and following thenoncritical patterning of the cell array.

FIG. 50 is a cross-sectional view of the wafer portion of FIG. 49following an RIE metal etch of the conductive layer and following theremoval of the photoresist pattern.

DETAILED DESCRIPTION

The method for fabricating the storage cell capacitor of the inventionis shown pictorially in FIGS. 2-11.

Referring to FIG. 2, a cross-sectional view of an in-process dynamicrandom access memory (DRAM) cell is shown following conventional localoxidation of silicon (LOCOS) or special LOCOS processing which createssubstantially planar field oxide regions 5 (created using modified LOCOSor trench isolation processes) and future active areas 6 (those regionsof the substrate not covered by field oxide) on a silicon substrate 7.The creation of the field oxide is preceded or followed by a thermallygrown dielectric layer 8 of silicon oxide. The depicted cell is one ofmany cells that are fabricated simultaneously and comprise a memoryarray. Following the creation of the field oxide region 5 and dielectriclayer 8 a first conductively doped polysilicon layer 10, a metalsilicide layer (Wsi_(x)) 15, an oxide layer 16, and a thick nitridelayer 20 are deposited. The thick nitride layer 20 will function as anetch stop during the storage node buried contact etch, thus allowingself-alignment if desired. The layers are patterned and etched to formwordlines 21 and N-channel (NCH) field effect transistors 22. Thepolysilicon layer 10 forms the gate regions of the FETs and is insulatedfrom lightly-doped source/drain regions 25 by the dielectric layer 8.The lightly-doped regions 25 are created utilizing a phosphorus orarsenic implant. Deposition, densification and a reactive ion etch (RIE)of a silicon-nitride spacer layer has created principal spacers 35 whichoffset an arsenic implant used to create the heavily-doped source/drainregions 30. Principal spacers 35 insulate-the wordlines and FETs fromsubsequent digit line and capacitor fabrications. Eventually thewordlines are connected to periphery contacts. The periphery contactsare located at the end of the array and are capable of being inelectrical communication with peripheral circuitry.

The formation of the FETs 22 and wordlines 21 as described are exemplaryof one application to be used in conjunction with the present embodimentof the invention. Other methods of fabrication and other applicationsare also feasible and perhaps equally viable.

In FIG. 3 a thick insulative conformal layer of undoped oxide 40 isblanket deposited to fill the storage node areas and overlie the FETS 22and wordlines 21. The oxide is undoped to minimize dopant out diffusionfrom the oxide 40 to the doped regions of the substrate. The oxide isplanarized, preferably chemical mechanically planarized (CMP), in orderto provide a uniform height. Optionally nitride, oxynitride or anothersuitable material may be deposited as the insulative layer.

At this juncture buried digit lines may be fabricated as described inU.S. Pat. No. 5,168,073 herein incorporated by reference. The subjectmatter of U.S. Pat. No. 5,168,073 is now explicitly described hereinwith respect to FIGS. 29-50 of the present application. In the casewhere the buried digit lines are formed by the method described in U.S.Pat. No. 5,168,073 the oxide 40 is deposited in two steps, one depositprior to the digit line formation and one deposit subsequent to thedigit line formation. In this case, an initial thick oxide layer isdeposited and planarized and then overlaid with a relatively thick Si₃N₄layer. The Si₃N₄ layer is then planarized. When the thick insulativelayer is comprised only of oxide it is possible for oxygen to diffusethrough the oxide. By overlying the oxide with Si₃N₄ it is possible toprohibit oxygen diffusion though the oxide.

Referring to FIG. 4, mask 53 defines self-aligned substrate contact area55. The oxide 40 is etched to form a self-aligned openings 50 exposingthe contact areas 55 of the substrate 7.

Referring to FIG. 5, in order to provide electrical communicationbetween the substrate 7 and the storage cell capacitor a polysiliconplug 65 is formed in each opening 50. The actual method used to form thepolysilicon plugs 65 is not critical, two options being a selectivesilicon growth from the contact area 55 or a doped polysilicondeposition and subsequent etch back or CMP back.

Referring now to FIG. 6, an upper portion of the polysilicon plugs 65 isremoved during a dry etch in order to form a recesses 70, Typically,this etch back is 50 to 400 nano meters (nm). In a case where thepolysilicon plugs 65 are formed during a selective silicon growth it ispossible to form the recess 70 by controlling the growth.

Referring to FIG. 7 a, a tantalum layer 75, with a thickness larger thanthe depth of the recesses 70, is formed by a chemical vapor deposition(CVD) or a sputtering process performed at room temperature. Thetantalum layer 75 provides a barrier against silicon diffusion, of thepolysilicon plug during subsequent high temperature anneals and othermaterials capable of prohibiting silicon diffusion may be used in placeof tantalum. For example, titanium and titanium nitride may be used aswell as other materials. Alternately, a tantalum layer 75 may be formedwherein the thickness is less than or equal to the depth of the recess.FIG. 7 b depicts the latter case. In this particular case the storagecell capacitor gains more vertical area thereby increasing capacitance.

Referring to FIGS. 8 a and 8 b, the tantalum layer 75 of FIGS. 7 a and 7b, respectively, is planarized, preferably by CMP, in order to expose atleast the oxide layer 40 and in order to retain tantalum 75 in recesses70 overlying the polysilicon plugs 65. Portions of the oxide layer 40may be planarized during this step. It is important, of course to retaina sufficient depth of tantalum 75 in order to inhibit silicon diffusionof the polysilicon plugs 65. It can be seen that only the upper surfaceof the tantalum layer 75 is exposed and that the tantalum sidewalls 80are protected by the oxide layer 40.

Referring to FIGS. 9 a and 9 b a platinum layer 85 is formed by CVD or asputtering technique. The platinum layer 85 overlies the tantalum layer75 shown in FIGS. 8 a and 8 b, respectively. Since the platinum layer 85is resistant to oxidation it provides an excellent surface for thedeposition of the high dielectric constant material. Other materialswhich are resistant to oxidation may be used in place of the platinum.For example, RuO₂ and TiN, as well as other non-oxidizing materials maybe used. Since the tantalum layer is recessed below the oxide layer 40,a thick layer of platinum may be deposited without decreasing thedensity of the device. By using very thick platinum electrodes, thecapacitance area is increased by the sidewall area contribution.Therefore, the platinum is deposited from at least a thickness of 50 nmto a thickness of 1 micro meter (μm).

FIGS. 10 a and 10 b depict the structure following the masking of theplatinum layer 85 overlying the tantalum and the removal of unmaskedportions of the platinum layer 85 to form the completed storage nodeelectrode of the storage cell capacitor. Typically the storage nodeelectrode is thought of as comprising the tantalum layer 75 and theplatinum layer 85. The polysilicon plug 65 is often thought of as anelectrical interconnect interposed between the substrate and the storagenode electrode, although it can be thought of as a portion of thestorage node itself.

FIGS. 11 a and 11 b depict the storage cell capacitor following adeposition and anneal of a dielectric layer 90 overlying the platinumlayer 85 of FIGS. 10 a and 10 b, respectively. The dielectric layer istypified as having a high dielectric constant. The storage cellcapacitor fabrication is completed with the sputter or CVD of a 50 to200 nm thick cell plate layer 95 to form a cell plate electrode. Thecell plate layer 95 is typically Platinum, TiN or some other conductivematerial.

Among the suitable materials for a dielectric layer having a highdielectric constant are Ba_(x)Sr_((1-x))TiO₃ [BST], BaTiO₃, SrTiO₃,PbTiO₃, Pb(Zr,Ti)O₃ [PZT], (Pb,La) (Zr,Ti)O₃ [PLZT], (Pb,La) TiO₃ [PLT],KNO₃, and LiNbO₃. In the applicant's invention BST is the preferredmaterial and is deposited at a thickness range of 30 nm-300 nm byRF-magnetron sputtering or CVD. The tantalum layer 75 is not oxidizedduring the application of a high temperature anneal due to the fact thatit is protected on its sidewalls 80 by the oxide layer 40 and that it isprotected on its upper surface by the platinum layer 85, see FIG. 11.Therefore even after the formation of the dielectric layer the recessretains the original tantalum 75 formed therein and capacitance is notsacrificed as it would be when portions of the tantalum 75 are consumedby oxidation. Therefore capacitance is effectively increased overmethods where portions of tantalum are oxidized.

The process can be continued or modified to accommodate the stepsdescribed in U.S. Pat. No. 5,168,073, previously incorporated byreference, for providing electrical interconnection between a pluralityof capacitors thus formed.

By utilizing the method of the preferred embodiments of the invention, ahigh density memory device is provided featuring a stacked capacitorformed in a compact area as a result of a dielectric layer having a highdielectric constant and retention of storage node integrity during ananneal of the dielectric layer and the capability of depositing a verythick platinum layer as a portion of the first electrode.

Although a process and an alternate process have been described forforming the storage cell capacitor it is apparent the process is equallyapplicable for the fabrication of other types of capacitors used inintegrated circuits. It should also be apparent to one skilled in theart that changes and modifications, such as deposition depths, may bemade thereto without departing from the spirit and scope of theinvention as claimed.

In the crown embodiment of the invention the initial formation of thecapacitor is accomplished according to the steps depicted in FIGS. 2-5and described in reference to FIGS. 2-5. The process continues withsteps 12-19. Layers corresponding to similar layers of the previousembodiments shall be numbered the same.

Referring now to FIG. 12, an upper portion of each polysilicon plug 65is removed during a dry etch in order to form recesses 70. Typically,this etch back is 50 to 400 nano meters (nrn). In a case where thepolysilicon plugs 65 are formed during a selective silicon growth it ispossible to form the recess 70 by controlling the growth.

Referring to FIG. 13, a tantalum layer 75 is formed by a chemical vapordeposition (CVD) or a sputtering process, which may be performed at roomtemperature. The tantalum layer 75 provides a barrier against silicondiffusion of the polysilicon plug during subsequent high temperatureanneals. Other materials capable of prohibiting silicon diffusion may beused in place of tantalum such as, for example: titanium nitride, TaN,Ti, RuO₂, and Ru.

Referring to FIG. 14, the tantalum layer 75 shown in FIG. 7 is etchedback in order to expose the oxide layer 40 and in order to retaintantalum 75 in recesses 70 overlying the polysilicon plugs 65. Thetantalum layer 75 should be recessed below a top surface of the exposedoxide layer 40. The etch back may be preceded by a planarization toremove the tantalum overlying the oxide layer 40. Portions of the oxidelayer 40 may be planarized during this step. The thickness of theinitial tantalum layer 75 is preferably such that after the etchback/planarization or the etch back the portion of the tantalum layer 75retained in the recess 70 has a depth sufficient to inhibit silicondiffusion of the polysilicon plugs 65. It can be seen that at thisjuncture of the process only the upper surface of the tantalum layer 75is exposed and the tantalum sidewall 80 is protected by the oxide layer40.

Referring now to FIG. 15, a platinum layer 85 is formed by CVD or asputtering technique. The platinum layer 85 overlies the tantalum layer75. Since the platinum layer 85 is resistant to oxidation it provides anexcellent surface for the deposition of the high dielectric constantmaterial. Other materials which are resistant to oxidation may be usedin place of the platinum. For example, RuO₂ and TiN, as well as othernon-oxidizing materials may be used. In this embodiment of the inventionthe platinum layer 85 is relatively thin, approximately 50 nm thick,although other thicknesses may be used without departing from the spiritand scope of the invention. The thickness of the platinum should begreat enough to substantially protect the tantalum layer 75 againstoxidation during BST deposition.

In FIG. 16 oxide 86 is deposited into the recess 70, and the structureis planarized to remove portions of the platinum layer 85 overlying theoxide layer 40.

In FIG. 17 the oxide layers 40 and 86 have been etched to expose avertical sidewall of the platinum layer 85 and the upper surface of theplatinum layer 85. It is necessary to retain a sufficient quantity ofoxide 40 at the lower sidewall of platinum layer 85 to eliminate thepossibility of oxidizing the tantalum layer 75. In order to retainsufficient oxide 40 while at the same time exposing the upper surface ofthe platinum layer 85 the densification of the oxide 86 must be lessthan the densification of oxide 40 in order for the oxide layer 86 toetch at a faster rate than the oxide layer 40.

Now the fabrication of the crown embodiment the storage node electrodeis complete. Although the polysilicon plug 65 is often thought of as anelectrical interconnect interposed between the substrate and the storagenode electrode, it can be thought of as a portion of the storage nodeelectrode itself.

FIG. 18 depicts initial formation of the storage cell capacitorfollowing a deposition and anneal of a dielectric layer 90 overlying theplatinum layer 85. The dielectric layer 90 is typified as having a highdielectric constant. The storage cell capacitor fabrication is completedwith the sputter or CVD of a 50 to 200 nm thick cell plate layer 95 toform a cell plate electrode. The cell plate layer 95 is typicallyplatinum, TiN or some other conductive material.

Following the deposition of the dielectric layer 90 and the cell platelayer 95 the storage cell capacitor is patterned and the cell platelayer 95 and the dielectric layer 90 are etched to complete thefabrication of the storage cell capacitor as shown in FIG. 19.

Among the suitable materials for a dielectric layer having a highdielectric constant are Ba_(x)Sr_((1-x))TiO₃ [BST], BaTiO₃, SrTiO₃,PbTiO₃, Pb(Zr,Ti)O₃ [PZT], (Pb,La) (Zr,Ti)O₃ [PLZT], (Pb,La) TiO₃ [PLT],KNO₃, and LiNbO₃. In currently envisioned embodiments BST is thepreferred material and is deposited at a thickness range of 30 nm-300 nmby RF-magnetron sputtering or CVD. The tantalum layer 75 is not oxidizedduring the application of a high temperature anneal due to the fact thatit is protected on its sidewall by the oxide layer 40 and that it isprotected on its upper surface by the platinum layer 85.

The process can be continued or modified to accommodate the stepsdescribed in U.S. Pat. No. 5,168,073, previously incorporated byreference, for providing electrical interconnection between a pluralityof capacitors thus formed.

By utilizing the method of the invention, a high density memory deviceis provided featuring a stacked capacitor formed in a compact area as aresult of a dielectric layer having a high dielectric constant. Thestacked capacitor of the invention retains storage node integrity duringan anneal of the dielectric layer.

In an alternate embodiment of the crown embodiment, the deposition ofthe tantalum layer is preceded by a deposition of a titanium barrierlayer 100, see FIG. 20. A thermal anneal is performed. The titanium incontact with the polysilicon plug reacts with the polysilicon to formtitanium silicide during the anneal. It is possible to perform theanneal in nitrogen. In this case the titanium still reacts with thepolysilicon to form titanium silicide, and the titanium which is not incontact with the polysilicon plug reacts with the nitrogen to form TiN.In addition a thin layer of nitrogen is formed overlying the titaniumsilicide.

In addition to titanium, other metals including refractory metals may beused. These refractory metals may include W, Co, Ta, and Mo.

Alternately a metal nitride, such as TiN, may be deposited instead of arefractory metal. The refractory metal and the metal nitride are bothcapable of reacting with the polysilicon plug to form a silicide duringan anneal.

Referring now to FIG. 21, the non-silicide layer (the unreactedtitanium, in the case of a non-nitrogen anneal, or TiN formed during thenitrogen anneal) and the thin layer of nitrogen formed overlying thetitanium silicide 105 have been removed during a wet etch. The titaniumsilicide 105 overlying the polysilicon plug is retained during the etch.

The process is continued as shown in FIGS. 22-28 and the processcorresponds to the process described with respect to FIGS. 13-19,respectively, of the previous embodiment with the exception that thebarrier layer 75 is TiN in the present embodiment rather than tantalumwhich was used in the previous embodiment. However, tantalum, TaN, Ti,RuO₂, and Ru may be used.

The titanium silicide layer 105 lowers a contact resistance between thepolysilicon plug 65 and the TiN layer 75.

The TiN layer 75 provides a barrier against silicon diffusion of thepolysilicon plug and the titanium silicide layer during subsequent hightemperature anneals.

An embodiment includes a storage cell capacitor and methods relating tofabrication of the components of the capacitor and related structures.Two embodiments of the invention are directed to maximizing storage cellcapacitance utilizing minimal masking steps. The capacitor of each cellmakes a self-aligned contact with a buried contact within the cell,while the capacitor extends to the active area of an adjacent cell. Theactive areas can be arranged in interdigitated columns andnoninterdigitated rows or simply parallel and in line to one another inboth the vertical and horizontal directions. The rows are referred to aswordlines, and the columns are referred to as digit lines or bit lines.The active areas are used to form active metal-oxide semiconductor (MOS)transistors that can be doped as NMOS or PMOS type FETs depending on thedesired use. The invention is a storage contact capacitor utilizing thevertical portion of the DRAM in which to fabricate a tungsten and TiNstorage node capacitor plate and the invention is the method forfabricating the same.

The process steps of the invention are shown pictorially in FIGS. 29-46.FIGS. 29-34 are pertinent to both embodiments of the invention. FIGS.35-40 are pertinent to the first embodiment, and FIGS. 41-46 arepertinent to the second embodiment.

Referring now to FIG. 29, a cross-sectional view of two in-process DRAMcells is shown following conventional local oxidation of silicon (LOCOS)or special LOCOS processing which creates substantially planar fieldoxide regions 201 (created using modified LOCOS process) and futureactive areas 202 (those regions of the substrate not covered by fieldoxide) on a silicon substrate 203. The creation of the field oxide ispreceded by a thermally grown dielectric layer 204 of silicon oxide. Thedepicted cells are two of many cells that are fabricated simultaneouslyand comprise a memory array. Following the creation of the field oxideregion 201 and dielectric layer 204 a first conductively dopedpolysilicon layer 210, a metal silicide layer (WSi_(x)) 215, an oxidelayer 216, and a thick nitride layer 220 are deposited. The thicknitride layer 220 will function as an etch stop during the storage nodeburied contact etch, thus allowing self-alignment. The layers arepatterned and etched to form wordlines 221 and N-channel (NCH) fieldeffect transistors 222. The polysilicon layer 210 forms the gate regionsof the FETs and is insulated from lightly-doped source/drain regions 225by the dielectric layer 204. The lightly-doped regions 225 are createdutilizing a phosphorus implant. Deposition, densification and a reactiveion etch (RIE) of a silicon dioxide spacer layer has created principalspacers 235 which offset an arsenic implant used to create theheavily-doped source/drain regions 230. Principal spacers 235 insulatethe wordlines and FETs from subsequent digit line and capacitorfabrications. Eventually the wordlines are connected to peripherycontacts. The periphery contacts are located at the end of the array andare capable of being in electrical communication with peripheralcircuitry.

After the RIE etch the punchthrough improvement implant is processed toimprove breakdown voltage of drain to source when V_(Gate) equals zerovolts (BVDSS) and to reduce subthreshold leakage. The gate oxide 204remains intact and the field oxide is not etched.

Although the formation of the FETs 222 and wordlines 221 as describedare preferred, other methods of fabrication are also feasible andperhaps equally viable. The following steps represent the methods of thetwo embodiments of the invention.

In FIG. 30 a conformal layer of undoped oxide 240 is blanket depositedto fill the storage node areas and overlie the FETS 222 and wordlines221. The oxide is undoped to minimize dopant out diffusion from theoxide 240 to the doped regions of the substrate. The oxide is planarizedin order to provide a uniform height.

In FIG. 31 a photoresist digit line contact 245 is used as an etch maskto create an opening 250 in which buried digit lines will be fabricated.The nitride layers 220 and principal spacers 235 protect the transistorpolysilicon layer 210 from the RIE oxide etch employed to form opening250. The protection afforded by the nitride layers 220 and principalspacers 235 effect self-alignment of the opening.

In FIG. 32 the photoresist shown in FIG. 31 has been removed, and thepreviously defined structures are overlaid with a blanket deposition ofpolysilicon 255 which in turn is overlaid with a blanket deposition ofstrapping material 260 comprising WSi_(x) or TiN. The area defined asthe digit line is masked with photoresist 265.

In FIG. 33 the unmasked polysilicon 255 and strapping material 260 areRIE etched to remove them from over the storage node areas 270 and fromthe top of the wordlines 221 polysilicon. The polysilicon 255 andstrapping material 260 that are retained after the etch define the digitline 266. The strapping material 260 has a relatively low resistancewhen compared to the resistance of the polysilicon layer 255. The lowerresistance of the strapping material 260 reduces the overall resistanceof the digit line 266. Eventually the digit lines will be connected toperiphery contacts. The periphery contacts are located at the end of thearray and are capable of being in electrical communication withperipheral circuitry.

The photoresist 265 shown in FIG. 32 is removed. A thick doped layer ofborophosphosilicate glass (BPSG) oxide 275 is blanket deposited tooverlie the structures of FIG. 33. The thick oxide layer 275 isdeposited to substantially define the desired height of a core portionof the storage capacitor. After planarization, either mechanical orchemical, the thick oxide 275 is masked with photoresist pattern 280 todefine future openings in the previously fabricated structures forfuture storage capacitors. Planarizing the thick oxide 275 eliminatesbit line stringers. The photoresist pattern 280 can also be used as acontact layer pattern for periphery contacts, thereby eliminating onemask, the buried contact mask. In this case openings would also beetched in the periphery of the DRAM device.

In FIG. 34 the oxide layers 240 and 275 are RIE etched to form opening281 and expose the contact areas 282 of the substrate. Following theetch, the photoresist 280 shown in FIG. 33 is removed.

FIG. 35 is a portion of the wafer portion shown in FIG. 34. In FIG. 35 aTiN deposition 285 has been followed by tungsten fill deposition 290.The TiN deposition typically has a thickness equal to 1 KA. A cavityhaving a similar thickness is capable of accepting dielectric and cellpolysilicon depositions.

TiN is a diffusion barrier metal providing a diffusion barrier betweenthe N+ junction and the tungsten. The TiN also provides a low contactresistance without damaging the contact area of the substrate. TiN 285is deposited first since it can be uniformally and evenly distributed tocontact the previously fabricated areas and it provides a good contactmedium for the subsequent tungsten fill 290. The TiN 285 also provideselectrical communication between the substrate contact areas 282 and thetungsten 290. It is conceivable that TiN may be replaced with otherdiffusion barrier materials having similar properties.

Tungsten is a highly conductive refractory metal that can withstand hightemperatures in the range of 600° C. to 900° C. This is necessary due toa subsequently deposited polysilicon layer. The polysilicon depositionis typically in the vicinity of 650° C. The tungsten can be replacedwith other refractory metals comprising WSi_(x), titanium, and titaniumsilicide. It is conceivable that as technology advances processing stepssubsequent to the tungsten deposition may be performed at higher orlower temperatures. The temperature parameters qualify the refractorymetal and are indicative of the current process. Since the temperatureparameters may change as the fabrication process evolves, the refractorymetals applicable to the process may change accordingly.

The tungsten 290 and TiN 285 are shown in FIG. 36 after a mechanicaletch to effect planarization of the tungsten 290, TiN 285 and thickoxide 275.

TiN can be selectively etched over tungsten. In FIG. 37 the TiN 285 iscontrollably etched by a piranha (either wet or vapor) etch method toform trenches 286 while retaining a portion of TiN 285 to contact thecontact area 282 of the substrate 203. Any periphery contacts alreadyfabricated must be protected by a mask during the piranha etch. Thetrenches 286 are each approximately IKA wide extending approximately 2microns from the top of the tungsten. The retained portion of TiN 285envelops a lower portion of the tungsten 290. The TiN 285 and tungsten290 thus formed comprise the lower capacitor plate 295. The trenches 286increase the size of the storage node plate thus increasing capacitance.

In FIG. 38 a thin polysilicon layer 314 is blanket deposited to overlieexposed portions of the oxide 275, the TiN 285, and tungsten 290. Thepolysilicon layer 314 typically has a thickness of 50 Å (angstroms) andprovides a silicon surface on which to blanket deposit a thin dielectriclayer 415 typically having a thickness of 100 Å (angstroms). Thedielectric layer typically comprises of silicon nitride, although otherdielectric materials such as silicon dioxide are equally viable. Anoptional wet anneal may be performed subsequent to the silicon nitridedeposition to oxidize the silicon in pinholes of the nitride. The wetanneal improves dielectric breakdown properties of the capacitor thusformed. The dielectric is typically silicon nitride. A thick cellpolysilicon layer 320 is deposited to overlie the dielectric layer andcompletely fills in the trenches 286 previously formed. The thick cellpolysilicon layer 320 is subjected to an insitu phosphorous diffusiondoping to decrease its resistivity. The cell plate comprises the cellpolysilicon layer 320. In order to protect the thick cell polysiliconlayer 320 during subsequent oxidization steps of the fabrication processa thin layer of oxidation resistant silicon nitride 325 is blanketdeposited to overlie the thick cell poly layer 320.

The cell polysilicon layer is patterned only within the storagecapacitor with photoresist mask 330 as shown in FIG. 39.

In FIG. 40 polysilicon layer 314, cell polysilicon layer 320, anddielectric layer 315 and nitride layer 325 are RIE etched in theunmasked areas, and the photoresist 330 as shown in FIG. 39 is removed.Oxide 330 is grown to insulatively seal the sides of the polysiliconlayers 314 and 320.

In FIG. 41 the nitride layer 325 shown in FIG. 40 is RIE etched and alayer of conductive material 340 is deposited to create a cell polyinterconnect and eliminate a cell poly mask. Conductive material 340functions as a cell polysilicon interconnect and eliminates a cellpolysilicon mask. The conductive material 340 preferably comprises ametal such as aluminum, tungsten, Al/Si/Cu, or another aluminum/copperalloy. This layer of conductive material 340 is typically usedthroughout the circuit periphery. In order to retain the conductivematerial overlying and in contact with portions of cell polysiliconlayer 320 the conductive material 340 is masked by photoresist 345 in anoncritical alignment pattern over the cell array in order to connectall the cell polysilicon over the storage node. Since the cellpolysilicon is aligned with the storage node poly pattern, a cellpolysilicon masking step is eliminated.

In FIG. 42 the unmasked conductive material 340 has been RIE metaletched, the photoresist 345 shown in FIG. 41 has been removed and thefabrication of storage capacitors 350 is complete. The lower capacitorplate 395 of storage capacitors 350 comprise the tungsten 290 andtitanium nitride 285 portions. The cell plate comprises the thick cellpolysilicon layer 320. The conductive material 340 provides electricalcommunication between the cell plates of the capacitors 350 fabricatedby the method of the first embodiment. The cell plate and storage nodecapacitor plate are electrically insulated from each other by thedielectric layer 345.

The process steps of the second embodiment of the invention areidentical to the process steps of the first embodiment for the stepsdescribed relative to FIGS. 29-34. In the second embodiment of theinvention, the openings 282 formed in FIG. 34 are deposited withalternating layers of TiN 360 and tungsten 365 as shown in FIG. 43 whichis a portion of the wafer portion shown in FIG. 34. The initial deposit366 being TiN and the final deposit 367 being tungsten. Although thetotal number of layers is optional at least two tungsten layers and twoTiN layers are employed.

In FIG. 44 the storage node is defined by masking the alternating layerswith a photoresist pattern 370. The alternating layers are then RIEetched.

In FIG. 45 the photoresist pattern 370 shown in FIG. 44 is removed andthe fabrication of the storage node is completed by selectively andcontrollably etching the TiN by a piranha (either wet or vapor) etchmethod to form tungsten fingers 375 extending substantially normallyfrom the TiN 360 retained after the etch. Any periphery contacts alreadyfabricated must be protected by a mask during the piranha etch. Apiranha etch is an etch wherein the etch solution comprises a solutionof hydrogen peroxide plus sulfuric acid. The fingers diverge and areelevationally stacked in a parallel configuration over the oxide 275.The total height of the stacked portion of the storage node is dependenton the number of layers deposited and the thickness of the layers.

In FIG. 46 a thin polysilicon layer 380 typically having a thickness of50 Å (angstroms) is deposited to overlie all exposed surfaces. Thepolysilicon layer 380 provides a silicon surface for a subsequentdielectric deposition. A thin dielectric layer 381 comprising siliconnitride is deposited to overlie the polysilicon 380. The dielectriclayer 381 typically has a thickness of 100 Å (angstroms). An optionalwet anneal may be performed subsequent to the deposition of thedielectric layer 381 to oxidize the silicon in pinholes of the nitride.A cell polysilicon layer 385 is deposited to overlie the dielectriclayer. The cell polysilicon 385 layer is subjected to an insituphosphorous diffusion doping to decrease its resistivity. In order toprotect the thick cell polysilicon layer 385 during subsequentoxidization steps of the fabrication process a thin layer of oxidationresistant silicon nitride 390 is blanket deposited to overlie the thickcell polysilicon layer 385.

The cell polysilicon layer is patterned only within the storagecapacitor with photoresist mask 400 as shown in FIG. 47.

In FIG. 48 polysilicon layer 380, cell polysilicon layer 385, dielectriclayer 381, and nitride layer 390 are RIE etched in the unmasked areas,and the photoresist 400 as shown in FIG. 47 is removed. Oxide 395 isgrown to insulatively seal the sides of the polysilicon layers 380 and385.

In FIG. 49 the nitride layer 390 shown in FIG. 48 is RIE etched and alayer of conductive material 400 is deposited to create a cell polyinterconnect and eliminate a cell poly mask. Conductive material 400functions as a cell polysilicon interconnect and eliminates a cellpolysilicon mask. The conductive material 400 preferably comprises ametal such as aluminum, tungsten, Al/Si/Cu, or another aluminum/copperalloy. This layer of conductive material 400 is typically usedthroughout the circuit periphery. In order to retain the conductivematerial overlying and in contact with portions of cell polysiliconlayer 385 the conductive material 400 is masked by photoresist 410 in anoncritical alignment pattern over the cell array in order to connectall the cell polysilicon over the storage node. Since the cellpolysilicon is aligned with the storage node poly pattern, a cellpolysilicon masking step is eliminated.

In FIG. 50 the unmasked conductive material 400 has been RIE metaletched, the photoresist 410 shown in FIG. 49 has been removed and thefabrication of storage capacitors 425 is complete. The lower capacitorplate 375 of storage capacitors 425 comprise the tungsten 365 andtitanium nitride 360 portions. The cell plate comprises the thick cellpolysilicon layer 385. The conductive material 400 provides electricalcommunication between the cell plates of the capacitors 325 fabricatedby the method of the first embodiment. The cell plate and storage nodecapacitor plate are electrically insulated from each other by thedielectric layer 381. At this juncture the cell polysilicon may bemasked and etched and a conductive material may be deposited as in thefirst embodiment to create the cell polysilicon interconnect.

These embodiments of the invention allows the vertical portion of a DRAMdevice to be utilized as the storage cell thus maximizing die space inthe horizontal direction, and reducing the stack capacitor height priorto contacts. Controllably etching the TiN increases capacitor area andcapacitance. A mask step is eliminated over previous methods since thereis no cell polysilicon mask. Thus the increase in capacitance iseffected using minimal masking steps and minimal surface area of theDRAM device.

The process also facilitates the effective use of a buried digit lineconfiguration. There are no digit line stringers, thus yield isincreased.

Although as described the first embodiment is applicable to 4-megabitthrough 64-megabit, and the second embodiment is typically employed inDRAMs containing up to 256 megabit DRAM cells, the process is notlimited to these uses.

Although polycrystalline silicon is used in the capacitor fabrication ofthe preferred embodiments, amorphous and monocrystalline silicon mayalso be used.

Embodiments of the invention are adapted to increase density of a memorydevice by increasing capacitance of storage cell capacitors. The storagecell capacitor features a storage node electrode having a barrier layerof tantalum or another material which experiences no oxidation duringthe formation of the storage cell capacitor. The barrier layer isinterposed between a conductive plug and a non-oxidizing conductivematerial such as platinum. A dielectric layer, typicallyBa_(x)Sr_((1-x)) TiO₃ [BST], is deposited on the non-oxidizing material.The barrier layer is surrounded on its sides by an insulative layer. Theinsulative layer protects the barrier layer from oxidizing during thedeposition and anneal of the BST thereby also eliminating oxidization ofthe conductive plug. By eliminating oxidization of the barrier layer andthe conductive plug capacitance is maximized.

Although a process has been described for forming the storage cellcapacitor, it is apparent the process is equally applicable for thefabrication of other types of capacitors used in integrated circuits. Itshould also be apparent to one skilled in the art that changes andmodifications, such as deposition depths, may be made thereto withoutdeparting from the spirit and scope of the invention as claimed.

1. A method for fabricating an integrated circuit structure on asubstrate, comprising: forming an insulative layer on the substrate;forming a first opening in the insulative layer; forming digit lines inthe first opening; forming a second opening in the insulative layer; andforming an electrode, wherein forming the electrode includes: forming afirst portion of the electrode in a lower region of the second opening;forming a second portion of the electrode in the second opening andoverlying the first portion, said insulative layer encompassing asidewall of said second portion; forming a third portion of theelectrode overlying the second portion and overlying at least a portionof the insulative layer, wherein said first portion and said secondportion are different materials; and forming a dielectric layer on thethird portion, with the dielectric layer including a material from agroup of materials consisting of Bax Sr(1-x) TiO₃, BaTiO₃, SrTiO₃,PbTiO₃, Pb(Zr,Ti)O₃, (Pb,La)(Zr,Ti)O₃, (Pb,La)TiO₃, KNO₃, and LiNbO₃. 2.The method of claim 1, wherein said second portion and said thirdportion are different materials.
 3. The method of claim 2, wherein saidfirst portion and said third portion are different materials.
 4. Themethod of claim 1, wherein forming digit lines in the first openingincludes: masking the substrate with a first digit line photoresist todefine a region of the substrate reserved for digit line formation;reactive ion etching the substrate to form a self-aligned opening in thefirst opening and to expose at least a portion of the substrate;removing the first digit line photoresist: blanket depositing a digitline conductive layer to overlie at least the exposed substrate; blanketdepositing a strapping layer to overlie the digit line conductive layer,the strapping layer having a lower resistance than the digit lineconductive layer; patterning the digit lines with a second digit linephotoresist overlying digit line areas; etching the digit lineconductive layer and the strapping layer and retaining the digit lineconductive layer and said strapping layer in digit line areas, theretained layers forming the digit lines, the strapping layer reducing anoverall resistance of the digit lines; and removing the second digitline photoresist.
 5. The method of claim 4, wherein forming theelectrode includes connecting the electrode to the digit line through atransistor.
 6. A method for fabricating an electrode, comprising:forming an insulative layer; forming buried digit lines: forming anopening in the insulative layer; forming a first portion of theelectrode in a lower region of the opening; forming a second portion ofthe electrode in the opening and overlying the first portion, saidinsulative layer encompassing a sidewall of said second portion; forminga third portion of the electrode overlying the second portion andextending above a top surface of the insulative layer, wherein saidfirst portion and said second portion are different materials; andforming a dielectric layer on the third portion, with the dielectriclayer including a material from a group of materials consisting of BaxSr_((1-x)), TiO₃, BaTiO₃, SrTiO₃, PbTiO₃, Pb(Zr,Ti)O₃, (Pb,La)(Zr,Ti)O₃,(Pb,La)TiO₃, KNO₃, and LiNbO₃.
 7. The method of claim 6, wherein saidsecond portion and said third portion are different materials.
 8. Themethod of claim 7, wherein said first portion and said third portion aredifferent materials.
 9. The method of claim 6, wherein forming a thirdportion includes encompassing a lower sidewall of the third portion withsaid insulative layer.
 10. The method of claim 6, further comprisingforming a fourth portion underlying the second portion and overlying thefirst portion.
 11. The method of claim 6, wherein forming saidinsulative layer further comprises: depositing a first portion of saidinsulative layer to overlie said substrate; and depositing a secondportion of said insulative layer to overlie said first portion of saidinsulative layer, said second portion of said insulative layer havingoxidation resistant properties.
 12. The method of claim 11, whereinforming said insulative layer further comprises: patterning said secondportion of said insulative layer to define the opening; and removingexposed regions of said first and second portions of said insulativelayer to create the opening.
 13. The method of claim 11, wherein formingsaid insulative layer further comprises planarizing said first portionof said insulative layer.
 14. The method of claim 6, wherein formingburied digit lines includes: masking the substrate with a first digitline photoresist to define a region of the substrate reserved for digitline formation; reactive ion etching the substrate to form aself-aligned opening in the first opening and to expose at least aportion of the substrate; removing the first digit line photoresist:blanket depositing a digit line conductive layer to overlie at least theexposed substrate; blanket depositing a strapping layer to overlie thedigit line conductive layer, the strapping layer having a lowerresistance than the digit line conductive layer; patterning the digitlines with a second digit line photoresist overlying digit line areas;and etching the digit line conductive layer and the strapping layer andretaining the digit line conductive layer and said strapping layer indigit line areas, the retained layers forming the digit lines, thestrapping layer reducing an overall resistance of the digit lines. 15.The method of claim 14, wherein forming the digit lines includesremoving the second digit line photoresist.
 16. A method for fabricatingan integrated circuit structure on a substrate, comprising: forming aninsulative layer on the substrate; forming a first opening in theinsulative layer; forming digit lines in the first opening; forming asecond opening in the insulative layer; and forming an electrode,wherein forming the electrode includes: forming a first portion of theelectrode in a lower region of the second opening; forming a secondportion of the electrode in the second opening and overlying the firstportion, said insulative layer encompassing a sidewall of said secondportion; forming a third portion of the electrode overlying the secondportion and overlying at least a portion of the insulative layer,wherein said first portion and said second portion are differentmaterials; forming a dielectric layer on the third portion; and forminga fourth portion interposed between the first and the second portions,wherein the fourth portion is adapted to reduce contact resistancebetween the first and the second portions.
 17. The method according toclaim 16 wherein forming the first portion includes forming a siliconcontact.
 18. The method according to claim 16, wherein forming thesecond portion includes forming a diffusion barrier layer prohibitingdiffusion of atoms between the first and the second portions.
 19. Themethod according to claim 16, wherein forming the third portion includesforming an oxidation resistant layer.
 20. The method according to claim16, wherein forming digit lines includes: masking the substrate with afirst digit line photoresist to define a region of the substratereserved for digit line formation; reactive ion etching the substrate toform a self-aligned opening in the first opening and to expose at leasta portion of the substrate; removing the first digit line photoresist:blanket depositing a digit line conductive layer to overlie at least theexposed substrate; blanket depositing a strapping layer to overlie thedigit line conductive layer, the strapping layer having a lowerresistance than the digit line conductive layer; patterning the digitlines with a second digit line photoresist overlying digit line areas;etching the digit line conductive layer and the strapping layer andretaining the digit line conductive layer and said strapping layer indigit line areas, the retained layers forming the digit lines, thestrapping layer reducing an overall resistance of the digit lines; andremoving the second digit line photoresist.
 21. An integrated circuitstructure, comprising: a buried digit line; and an electrode operativelyconnected to the buried digit line, the electrode including: a firstportion formed in an insulative layer having an upper surface; a secondportion overlying the first portion, wherein said insulative layersurrounds a sidewall of said second portion and said second portion doesnot extend above the upper surface; and a third portion overlying saidsecond portion and, extending above and below said upper surface of saidinsulative layer, and including a recess, wherein said first portion andsaid second portion are different materials, wherein said first portionis a silicon contact.
 22. The integrated circuit structure of claim 21,wherein the second portion and the third portion are differentmaterials.
 23. The integrated circuit structure of claim 22, wherein thefirst portion and the third portion are different materials.
 24. Theintegrated circuit structure of claim 21, wherein the buried digit lineincludes a patterned digit line conductive layer and a patternedstrapping layer.
 25. The integrated circuit structure of claim 24,wherein the strapping layer is adapted to reduce an overall resistanceof the digit lines.
 26. The integrated circuit structure of claim 21,wherein the buried digit line includes WSi_(x).
 27. The integratedcircuit structure of claim 21, wherein the buried digit line includesTiN.
 28. The integrated circuit structure of claim 21, wherein theburied digit line includes doped polysilicon.
 29. The integrated circuitstructure of claim 21, wherein the digit lines are formed prior to theelectrode.
 30. An integrated circuit structure, comprising: a burieddigit line including at least one from the group consisting essentiallyof WSi_(x) and TiN; and an electrode operatively connected to the burieddigit line, the electrode including: a first portion formed in aninsulative layer having an upper surface wherein said first portion is asilicon contact; a second portion overlying the first portion, whereinsaid insulative layer surrounds a sidewall of said second portion andsaid second portion does not extend above the upper surface, wherein thesecond portion and the first portion are different materials; and athird portion overlying said second portion and, extending above andbelow said upper surface of said insulative layer, and including arecess, and wherein the third portion and the second portion aredifferent materials.
 31. The integrated circuit structure of claim 30,wherein the buried digit line includes a patterned digit line conductivelayer and a patterned strapping layer.
 32. The integrated circuitstructure of claim 31, wherein the strapping layer is adapted to reducean overall resistance of the digit lines.
 33. An integrated circuitstructure, comprising: a buried digit line adapted to electricallycommunicate with external circuitry; an electrode operatively connectedto the buried digit line, the electrode including: a first portionformed in an insulative layer having an upper surface; a second portionoverlying the first portion, wherein the insulative layer surrounds asidewall of the second portion and the second portion does not extendabove the upper surface; and a third portion overlying said secondportion and, extending above and below said upper surface of saidinsulative layer, and including a recess, wherein said first portion andsaid second portion are different materials, wherein said second portionis a diffusion barrier layer prohibiting diffusion of atoms between saidfirst and said third portions.
 34. The integrated circuit structure ofclaim 30, wherein the buried digit line includes at least one from thegroup consisting essentially of WSi_(x) and TiN.
 35. The integratedcircuit structure of claim 30, wherein the buried digit line includes apatterned digit line conductive layer and a patterned strapping layeradapted to reduce an overall resistance of the digit line.
 36. Anintegrated circuit structure, comprising: a digit line; a capacitoroperatively connected to the digit line, the capacitor including anelectrode having: a first portion formed in an insulative layer havingan upper surface; a second portion overlying the first portion, whereinsaid insulative layer surrounds a sidewall of said second portion andsaid second portion does not extend above the upper surface; and a thirdportion overlying said second portion and, extending above and belowsaid upper surface of said insulative layer, and including a recess,wherein said first portion and said second portion are differentmaterials, wherein said third portion is an oxidation resistant layer.37. The integrated circuit structure of claim 36, wherein saidinsulative layer surrounds a lower sidewall of said third portion. 38.The integrated circuit structure of claim 36, wherein the digit line isadapted to connected to an address producing circuit of a memory device,and wherein the capacitor is a storage device for the memory device. 39.The integrated circuit structure of claim 38, wherein the memory deviceis a random access memory.
 40. The integrated circuit structure of claim36, wherein the digit line includes WSi_(x).
 41. The integrated circuitstructure of claim 36, wherein the digit line includes TiN.
 42. Theintegrated circuit structure of claim 36, wherein the capacitor includesa dielectric layer overlying the third portion; and a cell plateelectrode overlying the dielectric layer.
 43. The integrated circuitstructure of claim 36, wherein the capacitor is operatively connected tothe digit line through a transistor.
 44. An integrated circuitstructure, comprising: a digit line; a capacitor operatively connectedto the digit line, the capacitor including an electrode having: acontact formed in an insulative layer having an upper surface; adiffusion barrier portion overlying said contact, said insulative layersurrounding a sidewall of said diffusion barrier portion and saiddiffusion barrier portion not extending above said upper surface; and anoxidation resistant portion overlying said diffusion barrier portionand, extending above and below said upper surface of said insulativelayer, and including a recess, said diffusion barrier portion configuredto inhibit diffusion of atoms between said contact and said oxidationresistant portion.
 45. The integrated circuit structure of claim 44,wherein the digit line includes WSi_(x).
 46. The integrated circuitstructure of claim 44, wherein the digit line includes TiN.
 47. Theintegrated circuit structure of claim 44, wherein the capacitor includesa dielectric layer overlying the third portion; and a cell plateelectrode overlying the dielectric layer.
 48. The integrated circuitstructure of claim 47, wherein the first portion of the electrode isoperatively connected to the digit line through a transistor.
 49. Theintegrated circuit structure of claim 44, wherein the buried digit lineincludes a patterned digit line conductive layer and a patternedstrapping layer adapted to reduce an overall resistance of the digitline.
 50. An integrated circuit structure, comprising: a digit lineincluding at least one from the group consisting essentially of WSi_(x)and TiN; a capacitor operatively connected to the digit line, thecapacitor including an electrode having: a first portion formed in aninsulative layer having an upper surface; a second portion overlying thefirst portion, wherein said insulative layer surrounds a sidewall ofsaid second portion and said second portion does not extend above theupper surface; and a third portion overlying said second portion,extending above and below said upper surface of said insulative layer,and including a recess, wherein said first portion and said secondportion respectively consist essentially of polysilicon and tantalum.51. The integrated circuit structure of claim 50, wherein the thirdportion consists essentially of platinum.